Ömer Faruk Yildiz

Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates


Front	Back

ISBN:

978-3-8440-9002-4

Series:

Elektrotechnik

Keywords:

Microwave Engineering; Low Temperature Cofired Ceramics; Ceramic Substrates

Type of publication:

Thesis

Language:

English

Pages:

166 pages

Figures:

69 figures

Weight:

227 g

Format:

21 x 14,8 cm

Bindung:

Paperback

Price:

48,80 € / 61,10 SFr

Published:

March 2023

Buy:

DOI:

10.2370/9783844090024 (Online document)

Download:

Available PDF-Files for this title:

You need the Adobe Reader, to open the files. Here you get help and information, for the download.

These files are not printable.


	Document		Document
	Type		PDF
	Costs		36,60 EUR
	Action		Purchase in obligation and display of file - 27,6 MB (28947564 Byte)
	Action		Purchase in obligation and download of file - 27,6 MB (28947564 Byte)


	Document		Table of contents
	Type		PDF
	Costs		free
	Action		Display of file - 1,8 MB (1836799 Byte)
	Action		Download of file - 1,8 MB (1836799 Byte)

User settings for registered users

You can change your address here or download your paid documents again.

User:	Not logged in.
Actions:	Login / Register Forgotten your password?

Recommendation:

You want to recommend this title?

Review copy:

Here you can order a review copy.

Link:

You want to link this page? Click here.

Export citations:

Text
BibTex
RIS

Abstract:

In this thesis, vertical interconnect accesses (vias) are deployed as functional elements for the design of vertically integrated microwave components on multilayer low temperature cofired ceramic (LTCC) substrates. Functional via structures do not support transverse electromagnetic (TEM) modes but effectively behave like quasi-transmission lines up to 40 GHz if designed properly. Vertical integration is applied to a variety of passive microwave components including low- and band-pass filters, hybrid couplers, and N-way Wilkinson power dividers. The analysis for each component is comprised of the delineation of the design procedure, full-wave simulations, and lastly measurements up to 50 GHz of the manufactured prototype. The study is completed by examining the limiting case of via arrays, where many signal vias are in close proximity to each other, which gives insight into maximum coupling and crosstalk behavior.